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Thinning and miniaturization of the connector
  Published:2012-08-30 10:00:30   Views:

In recent years, with the increasing miniaturization and multi-functional mobile phones, smart phones, digital cameras, digital video cameras, digital audio players and game consoles and other consumer electronic products, a variety of installation components increasing trend. In order to get more efficient use of the limited board space, further thinning of the spare parts to be installed and miniaturization are increasingly high requirements.


The newly developed "5803 series" 0.4mm pitch board-to-board connector to achieve the industry's lowest of the plug connector and socket machine with a height of 0.5mm and the industry's smallest width 2.4mm *. This not only further reduce the mounting area of the circuit board, and reduction in height of the inter-substrate for electronic products streamlining contribute. Further, the back of the connector, no metal is exposed, to ensure the insulation of the back of the connector and the substrate, to improve the degree of freedom in the wiring of the substrate. In particular, a unique contact member structure, the impact of the splash of flux and a circuit board of foreign matter such as debris can be eliminated to achieve a high contact reliability.


With the introduction of this product will contribute to the miniaturization of consumer electronics products.